Application Field
Substrates of Electronic Components：Smartphones, Tablet PC, Laptops, Liquid Crystal Display Screens etc.
Product Features
- Web：PI Film (12~175μm), Copper Foil (9~36μm)
- Dryer：
- Max. Temperature：200℃
- Multiple temperature control zones
- 3M/zone
- Dryer length is adjustable. - Nozzle velocity can be adjusted by converter.
- (A) Available for High Viscosity：10,000-100,000 cps
- (B) Non-impulsive adhesive supplying
- Upper Tension of Lamination：1~5 kg ± 0.1 kg
Technical Parameters
- Coating Method：Slot Die
- Coating Weight (Dry)：
- 3 layer：10~30μm± 1 μm
- 2 layer：12~20μm ±1 μm - Laminating (Heating) Roll：
- Max. Temperature：150℃
- Available Area Temperature：±1℃ - Roll Surface Width：700 mm
- Web Width：500~650 mm
- Max. Unwinding & Winding Diameter：500 mm
- Max. Unwinding & Winding Weight：300 kg
- Mechanical Speed：1.5~20 M/min