Flexible Copper Clad Laminate (FCCL) Coating Machine

Application Field

Substrates of Electronic Components:Smartphones, Tablet PC, Laptops, Liquid Crystal Display Screens etc.


Product Features

  • Web:PI Film (12~175μm), Copper Foil (9~36μm)
  • Dryer:
       - Max. Temperature:200℃
       - Multiple temperature control zones
       - 3M/zone
       - Dryer length is adjustable.
  • Nozzle velocity can be adjusted by converter.
  • (A) Available for High Viscosity:10,000-100,000 cps
  • (B) Non-impulsive adhesive supplying
  • Upper Tension of Lamination:1~5 kg ± 0.1 kg

Technical Parameters

  • Coating Method:Slot Die
  • Coating Weight (Dry):
       - 3 layer:10~30μm± 1 μm
       - 2 layer:12~20μm ±1 μm
  • Laminating (Heating) Roll:
       - Max. Temperature:150℃
       - Available Area Temperature:±1℃
  • Roll Surface Width:700 mm
  • Web Width:500~650 mm
  • Max. Unwinding & Winding Diameter:500 mm
  • Max. Unwinding & Winding Weight:300 kg
  • Mechanical Speed:1.5~20 M/min